The conference will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications, so any contribution about this is welcome. Beside this general approach this year the focus will be on the following topics:
• Wafer Bonding for electronics and multisystem integration
• Metal based Wafer Bonding Technologies
• Temporary Wafer Bonding for Wafer Thinning and Thin Wafer Handling
• Wafer Bonding in Industrial Processes: Processes Stability and Reliability
• Enabling new Technologies and Devices for modern Applications by Wafer Bonding
• Low and room temperature wafer bonding
• The future of Wafer Bonding
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| PROGRAM TUESDAY 2017-11-28 | |
| 09:00 am | R. Knechtel - Technical Chair -Welcome and Opening |
| 09:05 am | L. Peng - Local Chair IMEC - Welcome by Local organizers |
| 09:10 am | A. Jourdain - Local Chair IMEC - Presentation of the hosting organisations |
| 09:20 am | D. Van Thourhout - Univeristy Gent - Keynote: Wafer bonding for silicon photonics and laser applications |
| Session 1 | Wafer Bonding Applications I - Chair: Roy Knechtel |
| 09:50 am | M. Winkler - BOSCH - Two different cavity pressures in a single MEMS chip realized in one bonding process |
| 10:05 am | A. Sanz-Velasco - IMT Masken und Teilungen AG - Low temperature bonding of structured glass substrates for life science application |
| 10:20 am | A. Stassen - IMEC - Tape-assisted fusion bonding for wafers with through Si holes |
| 10:35 am | Coffee break |
| Session 2 | Low Temperature Bonding - Chair: K.-D. Hobart / T. Suga |
| 11:00 am | H. Re - University Tokyo - Surface Activated Bonding Methods for Low-Temperature Cu/SiO2 and Cu/Adhesive Bonding |
| 11:15 am | X. Wang - KTH Stockholm - Low-Temperature Wafer-Level Vacuum Packaging Featuring Narrow Footprint Copper Sealing Rings |
| 11:30 am | Ch. Flötgen - EV Group - Structural and Electrical Characterization of Room Temperature, Oxide-free, Si Bond Interface |
| 11:45 am | M. Baum - Fraunhofer ENAS - Cu-Cu low temperature bonding with surface pre-treatment methods |
| 12:00 am | F. Dreisow - Fraunhofer IOF - Low temperature bonding of dielectric coated prisms for beam splitter applications |
| 12:15 am | Lunch break |
| 01:30 pm | Poster Flash Session - Chair: R. Knechtel |
| click here to see the list of submitted posters | |
| Session 3 | Charaterization - Chair: M. Eichler / D. Dussault |
| 02:30 pm | F. Fournel - CEA, Leti - Impact of Water Movement on Direct Bonding Characterization |
| 02:45 pm | M. Liao - UCLA - Interface misorientation, lattice mismatch, and passivation: Electrical transportacross III-V bonded structures |
| 03:00 pm | N. Razek - EV Group - Room temperature SiC/SiC and Si/SiC direct wafer bonding |
| 03:15 pm | Coffee break |
| Session 4 | Wafer Bonding Applications II - Chair: M. Wiemer / Ch. Landesberger |
| 04:00 pm | C.S. Tan - Nanyang Technological University - Germanium-on-silicon nitride (GON) for mid-IR photonic applications |
| 04:15 pm | A. Malainou - IMEC - Cavity Wafer Bonding after Deep Silicon Etch |
| 04:30 pm | T. Shimatsu - Tohoku University - Room Temperature Bonding of Wafers using Thin Metal Films for Optical Device Fabrications |
| 04:45 pm | H. Ishida - SUSS MicroTec Lithography - Wafer Bonding with Novel Method for Improved Post-Bond Alignment for High Volume Production in MEMS Applications |
| 05:00 pm | Social event |
| PROGRAM WEDNESDAY 2017-11-29 | |
| SESSION 5 | Fundamentals - Chairs: F. Fournel / A. Jourdain |
| 09:15 am | D. Dussault - proSys Inc. - Cleaning Processes for Wafer Bonding |
| 09:45 am | V. Larrey - CEA, Leti - Direct bonding mechanisms with SiOCH3 porous ultra low k layers |
| 10:15 am | G. A. Maier - Materials Center Leoben Forschung GmbH - 3D SubModell Approach to Introduce Surface Roughness to Cu-SiO2 Hybride Wafer Bonding Simulation |
| 10:30 am | Coffee break |
| Session 6 | 3D Integration - Chair: M. Petzold / D. Van Thourhout |
| 11:00 am | S. Dempwolf - X-FAB MEMS Foundry Erfurt GmbH - Heterogeneous System Integration by Waferbonding and Micro-Transfer-Printing |
| 11:15 am | O. O. Okudur - IMEC - Thermomechanical aspects of wafer-to-wafer copper–dielectric hybrid bonding for 3D integrated circuits |
| 11:30 am | Ch. Kaden - Fraunhofer IPMS - Customized B-SOI wafers - Integration of Additional Interconnects into the Handle Wafer |
| 11:45 am | J. De Vos - IMEC - Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications |
| 12:00 am | B. Rebhahn - EVG Group - Low and room temperature metal thermo-compression wafer bonding |
| 12:15 pm | Lunch break |
| Session 7 | Temporary and Adhesive Bonding - Chair: L. Peng / F. Fournel |
| 01:20 pm | Ch. Landesberger - Faunhofer EMFT - New Concept for Cost Efficient Temporray Wafer Bonding by Electrostatic Forces: "E-Foil" |
| 01:50 pm | T. Rogers - AML - A new carrier for temporary bonding featuring a fluoropolymer with temperature controlled stiction |
| 02:05 pm | J. Bertheau - IMEC - Development of wafer-level adhesive bonding for fine-pitch 3-D connections |
| 02:20 pm | K. Zoschke - Fraunhofer IZM - Laser Direct Patterning of Polymer Resins for Structured Adhesive Wafer to Wafer Bonding |
| 02:35 pm | A. Draisey - AML - Characterisation of a new adhesive for wafer bonding |
| 02:50 pm | Coffee break |
| Session 8 | Low Temperature Bonding - Chair: R. Knechtel |
| 03:10 pm | T. Suga - Univeristy Tokyo - Review Presentation: Low Temperature Bonding |
| 03:45 pm | R. Knechtel - Technical Chair - Closing Remarks |
| 04:00 pm | Lab Tour IMEC |